Bonding Pad Design Ⅱ

Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed

Layout design on bond pads to improve the firmness of bond wire in packaged IC products

Figure 5 from Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding

Bonding Pad Design Ⅱ

Applied Sciences, Free Full-Text

Design guide - Mandalon EN

ATP - Aluminum Bonding Pads

Bonding Pad Design Ⅱ

Bonding and Packaging of ICs

Wire Bonding Design in Detail