The outline of bump bond process steps. (1) deposition of field metal

Hans ANDERSSON, Principal Research Engineer

Hans ANDERSSON, Principal Research Engineer

Left) X-ray image of a line pair rule taken using an un-collimated

PDF) GaAs array fabrication

Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding

Hans ANDERSSON, Principal Research Engineer

PDF) GaAs array fabrication

A. Peacock's research works European Space Agency, Paris (ESA) and other places

Left) X-ray image of a line pair rule taken using an un-collimated

A. Peacock's research works European Space Agency, Paris (ESA) and other places

The outline of bump bond process steps. (1) deposition of field metal

PDF) GaAs array fabrication

A. Peacock's research works European Space Agency, Paris (ESA) and other places