Bump connections and wire bonds of 3D CMOL FPGA can serve as

Download scientific diagram | Bump connections and wire bonds of 3D CMOL FPGA can serve as programming communication channels and IOs respectively. from publication: 3D integration of CMOL structures for FPGA applications | In this paper, a novel 3D CMOS nanohybrid technology, 3D CMOL, is introduced to establish FPGA chips. By combining two leading technologies, hybrid CMOS/nanoelectronic circuit (CMOL) and 3D integration, 3D CMOL can provide a feasible and more efficient fabrication/assembly | FPGA, CMOS and FPGAs | ResearchGate, the professional network for scientists.

Signal Processing for Particle Detectors

Reliability of key technologies in 3D integration - ScienceDirect

Abbildung 3.2: Wertemenge und Bildmenge von (m + jn) 4 für 5-Bit-ADCs

Bump connections and wire bonds of 3D CMOL FPGA can serve as

Signal Processing for Particle Detectors

Bump connections and wire bonds of 3D CMOL FPGA can serve as

Golden bump for 20 micron diameter wire bond enhancement at reduced process temperature - ScienceDirect

Comparison to other template matching designs.

Circuit Architectures for 3D Integration

Geometry & Bond Improvements for Wire Ball Bonding & Ball Bumping

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The 3D structure of wire-bonding

Comparison to other template matching designs.